This is a customizable bondpad, where the size of the rectangular pads and the via pitch can be specified by the user. The top metal layer is M1 and the bottom metal layer is M2.

Reference

Click on the name of the component below to see the complete PCell reference.

 si_fab.all.BondPad Bondpad PCell with metal2 (M2) connected to metal1 (M1).

Example

from si_fab import all as pdk

name="BP",
metal1_size=(40.0, 60.0),
metal2_size=(40.0, 60.0),
via_pitch=(5.0, 5.0)
)

bp_p.Layout().visualize(annotate=True)


This bondpad inherits from BondPad. All the properties are locked to obtain an area of 50 $$\mu m$$ x 50 $$\mu m$$.

Reference

Click on the name of the component below to see the complete PCell reference.

 si_fab.all.BONDPAD_5050 Fixed default bondpad with an area of 50 x 50 um^2.

Example

from si_fab import all as pdk