Bondpad

SiFab contains two bondpads:

BondPad

This is a customizable bondpad, where the size of the rectangular pads and the via pitch can be specified by the user. The top metal layer is M1 and the bottom metal layer is M2.

Reference

Click on the name of the component below to see the complete PCell reference.

si_fab.all.BondPad

Bondpad PCell with metal2 (M2) connected to metal1 (M1).

Example

from si_fab import all as pdk

# Parametric bondpad

bp_p = pdk.BondPad(
    name="BP",
    metal1_size=(40.0, 60.0),
    metal2_size=(40.0, 60.0),
    via_pitch=(5.0, 5.0),
)

bp_p.Layout().visualize(annotate=True)
../../../../../../../../../_images/example_parametric_bondpad.png

BONDPAD_5050

This bondpad inherits from BondPad. All the properties are locked to obtain an area of 50 \(\mu m\) x 50 \(\mu m\).

Reference

Click on the name of the component below to see the complete PCell reference.

si_fab.all.BONDPAD_5050

Fixed default bondpad with an area determined by the design rules in the technology file (50 x 50 um^2).

Example

from si_fab import all as pdk

# Fixed bondpad

bp = pdk.BONDPAD_5050()
bp.Layout().visualize(annotate=True)
../../../../../../../../../_images/example_fixed_bondpad.png